Description
Technical specifications:
- Logic elements: ~67,000 (approx. 70K LUTs)
- Embedded memory: 3.2 Mbits
- DSP blocks: 320 18×18 multipliers
- High-speed I/O: Up to 16 SERDES channels
- Package: 1156-ball Fine Pitch BGA (FN1156)
- Operating voltage: 1.2V core, various I/O voltages
- Speed grade: -7 (high performance)
- Operating temperature: 0°C to +85°C (commercial)
- Applications: Video/image processing, telecom infrastructure, industrial networking, high-speed bridging
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