Description
Technical specifications:
- Memory density: 4Gb (Gigabit)
- Organization: 16M x 16
- Speed grade: 125 (DDR3-1600)
- Voltage: 1.35V (DDR3L low voltage)
- Package: 96-ball BGA
- Temperature range: -40°C to +85°C (industrial)
- Applications: Embedded systems, networking, industrial automation, medical devices
Reviews
There are no reviews yet.