Description
Technical specifications:
- Memory density: 512Mb (32M x 16)
- Data rate: Up to 800MT/s (DDR2-800)
- CAS latency: CL3, CL4, CL5, CL6 supported
- Operating voltage: 1.8V ±0.1V
- Package: 84-ball FBGA
- Operating temperature: 0°C to +85°C (commercial)
- Applications: Networking equipment, digital TVs, embedded computing, industrial automation
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