Description

Technical Specifications:

• Logic Elements: 230,000
• Transceivers: 36 high-speed transceivers
• Transceiver Data Rate: Up to 8.5 Gbps
• Embedded Memory: Extensive embedded memory blocks
• DSP Blocks: Multiple DSP blocks for efficient signal processing
• PCIe Support: Gen1 and Gen2
• Package Type: FBGA-1152
• Operating Voltage: 0.9V core voltage
• Operating Temperature Range: -40°C to +100°C
• Applications: Telecommunications, data centers, high-speed computing, signal processing, and embedded systems.

Product Features:

• Logic Elements: 230,000 logic elements for complex digital designs.
• High-Speed Transceivers: Up to 36 transceivers supporting data rates of up to 8.5 Gbps, ideal for high-speed communication.
• Embedded Memory: Large amounts of embedded memory for efficient data storage and processing.
• DSP Blocks: Integrated DSP blocks for high-performance signal processing applications.
• PCI Express Support: Native support for PCI Express Gen1 and Gen2 for seamless integration into modern systems.
• Clock Management: Advanced clock management features, including PLLs and DLLs for precise timing control.
• Low Power Consumption: Optimized for low power usage while maintaining high performance.
• Package: Fine-pitch Ball Grid Array (FBGA) with 1152 pins for robust connections and reliable performance.
• Temperature Range: Industrial-grade temperature range for reliable operation in demanding environments.