Description
Technical Specifications:
- Logic Elements: 353,600
- Embedded Memory: 22.04 Mbits
- Maximum Operating Frequency: 600 MHz
- Number of I/Os: 744
- Operating Voltage: 0.9V
- Package Type: FBGA-1152 (Fine-Pitch Ball Grid Array)
- Operating Temperature Range: -40°C to +85°C
- Applications: Ideal for high-speed data processing, telecommunications, and advanced computing systems.
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