Description

Technical Specifications:

• FPGA Logic Elements (LEs): 49,000
• Processor: Dual-Core ARM Cortex-A9
• Maximum Operating Frequency: Up to 925 MHz for ARM cores
• Memory Interfaces: DDR3, DDR3L, LPDDR2
• Transceivers: Up to 5.0 Gbps
• Package Type: 484-Ball UBGA (Ultra-Fine Ball Grid Array)
• Operating Temperature Range: 0°C to +85°C

Product Features:

• Integrated Dual-Core ARM Cortex-A9: Combines the flexibility of FPGA with a powerful dual-core ARM processor for high-performance embedded solutions.
• High FPGA Logic Density: Offers 49,000 Logic Elements (LEs) for complex digital designs.
• Extensive Memory Support: Equipped with on-chip memory and multiple external memory interfaces, supporting DDR3, DDR3L, and LPDDR2.
• Rich Peripheral Interfaces: Includes high-speed transceivers, PCIe, USB, Ethernet, and more for versatile connectivity.
• Low Power Consumption: Designed with low power consumption for energy-efficient applications.