Description
Technical Specifications:
- Core Architecture: PowerPC 603e
- Clock Speed: Up to 400MHz
- Memory Support: DDR SDRAM
- Ethernet Support: Dual 10/100 Mbps Ethernet controllers
- Interfaces: PCI, USB, I2C, SPI, UART
- Power Consumption: Optimized for embedded applications
- Operating Temperature: -40°C to +85°C
- Package Type: TEPBGA-516 (Thermally Enhanced Plastic Ball Grid Array)
- Applications: Networking routers, industrial automation, IoT gateways, and embedded computing.
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