Description
Technical specifications:
- Memory density: 2Gb (Gigabit)
- Organization: 16M x 16
- Speed grade: 125 (DDR3-1600)
- Operating voltage: 1.35V typical (DDR3L)
- Package: 96-ball BGA
- Operating temperature: -40°C to +85°C (industrial range)
- Applications: Consumer electronics, industrial automation, networking, embedded systems
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