Description
Technical Specifications:
- Core Architecture: PowerPC 603e
- Clock Speed: Up to 400MHz
- Memory Support: DDR SDRAM
- Ethernet: Dual 10/100 Mbps controllers
- Interfaces: PCI, USB, I2C, SPI, UART
- Power Efficiency: Optimized for embedded and networking applications
- Operating Temperature: -40°C to +85°C
- Package Type: TEPBGA-516 (Thermally Enhanced Plastic Ball Grid Array)
- Applications: Industrial control systems, networking routers, IoT gateways, and embedded computing.
Reviews
There are no reviews yet.