Description
Technical Specifications:
- Core Architecture: PowerPC 603e
- Clock Speed: 200MHz
- Memory Support: External memory interface for flexible storage options
- Cache: Integrated instruction and data caches
- Interfaces: Multiple system bus and I/O connectivity options
- Operating Voltage: 2.5V core, 3.3V I/O
- Operating Temperature: 0°C to +105°C
- Package Type: BGA (Ball Grid Array)
- Applications: Industrial automation, embedded computing, networking equipment, and aerospace systems.
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