Description

Technical Specifications:

• System Gates: 1.5 million
• I/O Pins: 144
• Package Type: FGG256 (Fine-Pitch Ball Grid Array, 256 pins)
• Operating Voltage: Core: 1.5V; I/O: 1.5V to 3.3V
• Embedded Analog: ADCs, DACs, and temperature sensors
• Clock Management: Integrated PLLs for advanced clock synchronization
• Operating Temperature: -40°C to +85°C (Industrial grade)
• Architecture: Flash-based, non-volatile FPGA with embedded analog functionality
• Applications: Industrial automation, automotive systems, medical devices, communications, and mixed-signal embedded designs.

Product Features:

• High System Gate Count: 1.5 million system gates for large-scale, complex designs.
• Non-Volatile FPGA: Flash-based architecture ensures instant-on functionality and reliable performance without external configuration memory.
• Integrated Analog Features: Built-in ADCs, DACs, temperature sensors, and programmable comparators for mixed-signal applications.
• Advanced Security: AES encryption for secure data and design protection.
• I/O Pins: 144 user I/Os supporting various standards such as LVTTL, LVCMOS, and PCI.
• Flexible Clocking: Integrated PLLs and advanced clock management for precise timing.
• Compact Package: FGG256 (Fine-Pitch Ball Grid Array with 256 pins) for high-density applications.
• Industrial Grade: Operates reliably in a temperature range of -40°C to +85°C.