Description

Technical Specifications:

• System Gates: 250,000
• I/O Pins: 97
• Package Type: FGG144 (Fine-Pitch Ball Grid Array, 144 pins)
• Operating Voltage: Core: 1.2V; I/O: 1.5V to 3.3V
• Clock Management: Integrated PLLs for precise and flexible clock generation
• Operating Temperature: -40°C to +85°C (Industrial grade)
• Architecture: Flash-based, non-volatile FPGA
• Applications: Consumer electronics, industrial automation, automotive systems, and embedded devices requiring low power and high reliability.

Product Features:

• Low-Power FPGA: Optimized for energy-efficient designs, making it perfect for power-sensitive applications.
• Non-Volatile Architecture: Flash-based FPGA ensures instant-on functionality and eliminates the need for external configuration memory.
• System Gates: 250,000 gates for medium-scale logic implementations.
• Integrated Security: Features AES encryption for secure design and data integrity.
• I/O Pins: 97 user I/Os to support various I/O standards such as LVTTL, LVCMOS, and PCI.
• Integrated PLLs: Advanced clock management for flexible and precise timing control.
• Compact Packaging: FGG144 (Fine-Pitch Ball Grid Array with 144 pins) for high-density applications.
• Temperature Range: Supports industrial-grade temperatures from -40°C to +85°C.