Description

Technical Specifications:

• System Gates: 250,000
• I/O Pins: 157
• Package Type: FGG256 (Fine-Pitch Ball Grid Array, 256 pins)
• Operating Voltage: Core: 1.5V; I/O: 1.5V to 3.3V
• Clock Management: Integrated PLLs for precise timing and clock synchronization
• Operating Temperature: -40°C to +85°C (Industrial grade)
• Architecture: Flash-based, non-volatile FPGA
• Applications: Industrial automation, consumer electronics, automotive systems, and power-sensitive embedded designs.

Product Features:

• Non-Volatile FPGA: Flash-based architecture ensures instant-on capability and secure operation without external configuration memory.
• System Gates: 250,000 gates for mid-scale logic designs.
• Low Power Consumption: Optimized for power-sensitive applications.
• Advanced Security: Built-in AES encryption for secure design implementation and data protection.
• I/O Pins: 157 user I/Os for flexible interfacing.
• Integrated PLLs: Offers precise and flexible clock management for advanced timing requirements.
• Packaging: FGG256 (Fine-Pitch Ball Grid Array with 256 pins), ideal for high-density designs.
• Temperature Range: Supports industrial-grade temperatures from -40°C to +85°C.
• Standards Compliance: Supports popular I/O standards, including LVTTL, LVCMOS, and PCI.